| Basic information: | |
| Released | 2013 |
| Segment | Mobile |
| Socket | Socket FP2 |
| Number of cores | 4 |
| Number of threads | 4 |
| Base frequency | 2300 MHz |
| Turbo Core | 3200 MHz |
| Unlocked multiplier | no |
| Architecture (core) | Trinity |
| Lithography | 32 nm |
| Transistors, mil. | 1303 |
| TDP | 35 W |
| Max. temperature | 100° C |
| Products webpage | follow > |
| Internal memory | |
| L1 Cache, Кb | 4x16+2x64 |
| L2 Cache, Кb | 4096 |
| L3 Cache, Кb | no |
| Integrated modules | |
| iGPU |
Radeon HD7000 series 497-686 MHz, 384 shaders |
| Memory controller | 2-channel (DDR3-1600, DDR3U-1333, DDR3L-1600) |
| PCIe controller | PCI Express 2.0 (16 lines) |
| Other modules |
• Unified Video Decoder (UVD) |
| Instructions, technology | |
|
• MMX • SSE • SSE2 • SSE3 • SSE4A • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard) • AVX (Advanced Vector Extensions) • BMI1 (Bit Manipulation inst. 1) • F16C (16-bit Floating-Point conversion) |
• FMA3 (3-operand Fused Multiply-Add) • FMA4 (4-operand Fused Multiply-Add) • TBM (Trailing Bit Manipulation) • XOP (eXtended Operations) • AMD64 • EVP (Enhanced Virus Protection) • AMD-V (AMD Virtualization) • Turbo Core • Turbo Core 3.0 • PowerNow! |
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