Grundinformation: | |
Veröffentlicht | 2015 |
Segment | Mobile |
Socket | BGA1356 |
Bus | 4 GT/s OPI |
Anzahl der Kerne | 2 |
Anzahl der Threads | 4 |
Grundfrequenz | 3100 MHz |
Turbo Boost | 3500 MHz |
Freigeschalteter Multiplikator | keine |
Architektur (Kern) | Skylake-H |
Lithographie | 14 nm |
TDP | 28 W |
Max. Temperatur | 100° C |
Produkt-Website | öffnen > |
Interner Speicher | |
L1 Cache, Кb | 2x32 + 2x32 |
L2 Cache, Кb | 2x256 |
L3 Cache, Кb | 4096 |
L4 Cache | eDRAM (64 MB) |
Integrierte Module | |
iGPU |
Intel Iris Graphics 550 300 - 1100 MHz |
Speichercontroller | 2-Kanal (DDR4-2133, LPDDR3-1866, DDR3L-1600) |
PCIe-Controller | PCI Express 3.0 (12 Lanes) |
Andere Module |
• eMMC controller • Legacy I/O • SATA controller • SD controller • USB controller |
Anweisungen, Technologien | |
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • BMI1, BMI2 (Bit Manipulation inst.) • F16C (16-bit Floating-Point conversion) |
• FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost 2.0 • TSX (Transactional Synchronization Extensions) • SGX (Software Guard Extensions) • Enhanced SpeedStep tech. |