Basic information: | |
Released | 2009 |
Segment | Mobile |
Socket | Socket S1 |
Bus | 1800 MHz 16-bit HT (3.6 GT/s) |
Number of cores | 2 |
Number of threads | 2 |
Base frequency | 2500 MHz |
Turbo Core | 2200 MHz |
Unlocked multiplier | no |
Architecture (core) | Caspian |
Lithography | 45 nm |
TDP | 35 W |
Max. temperature | 100° C |
Products webpage | follow > |
Internal memory | |
L1 Cache, Кb | 2x64+2x64 |
L2 Cache, Кb | 2048 |
L3 Cache, Кb | no |
Integrated modules | |
iGPU | no |
Memory controller | 2-channel (DDR2-800) |
PCIe controller | no |
Other modules | no |
Instructions, technology | |
• MMX • 3DNow! • SSE • SSE2 • SSE3 |
• SSE4A • AMD64 • AMD-V (AMD Virtualization) • EVP (Enhanced Virus Protection) • PowerNow! 2.0 |