| Grundinformation: | |
| Veröffentlicht | 2019 |
| Segment | Mobile |
| Socket | BGA1526 |
| Bus | 4 GT/s |
| Anzahl der Kerne | 4 |
| Anzahl der Threads | 8 |
| Grundfrequenz | 1200 MHz |
| Turbo Boost | 3700 MHz |
| Freigeschalteter Multiplikator | keine |
| Architektur (Kern) | Ice Lake-U |
| Lithographie | 10 nm |
| TDP | 15 W |
| Max. Temperatur | 100° C |
| Produkt-Website | öffnen > |
| Interner Speicher | |
| L1 Cache, Кb | 4x32 + 4x48 |
| L2 Cache, Кb | 4x512 |
| L3 Cache, Кb | 6144 |
| Integrierte Module | |
| iGPU |
Intel Iris Plus Graphics G7 300 - 1050 MHz |
| Speichercontroller | 2-Kanal (DDR4-3200, LPDDR4-3733) |
| PCIe-Controller | PCI Express 3.0 (16 Lanes) |
| Andere Module |
• Ethernet controller • Hardware HD audio codec • SATA controller • USB controller |
| Anweisungen, Technologien | |
|
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • AVX 512 (Advanced Vector Extensions 512) • BMI1, BMI2 (Bit Manipulation inst.) |
• F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost • MPX (Memory Protection Extensions) • Enhanced SpeedStep tech. |
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