Grundinformation: | |
Veröffentlicht | 2015 |
Segment | Mobile |
Socket | BGA1440 |
Bus | 8 GT/s DMI |
Anzahl der Kerne | 4 |
Anzahl der Threads | 8 |
Grundfrequenz | 2000 MHz |
Turbo Boost | 2800 MHz |
Freigeschalteter Multiplikator | keine |
Architektur (Kern) | Skylake |
Lithographie | 14 nm |
TDP | 25 W |
Max. Temperatur | 100° C |
Produkt-Website | öffnen > |
Interner Speicher | |
L1 Cache, Кb | 4x32 + 4x32 |
L2 Cache, Кb | 4x256 |
L3 Cache, Кb | 8192 |
Integrierte Module | |
iGPU |
Intel HD Graphics 530 350 - 1000 MHz, 24 ex.units |
Speichercontroller | 2-Kanal (DDR3L-1600, LPDDR3-1866, DDR4-2133) |
PCIe-Controller | PCI Express 3.0 (16 Lanes) |
Andere Module | keine |
Anweisungen, Technologien | |
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • BMI1, BMI2 (Bit Manipulation inst.) • F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add inst.) |
• EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost 2.0 • TXT (Trusted Execution tech.) • TSX (Transactional Synchronization Extensions) • MPX (Memory Protection Extensions) • SGX (Software Guard Extensions) • Enhanced SpeedStep tech. |