| Grundinformation: | |
| Veröffentlicht | 2021 |
| Segment | Server |
| Socket | Socket SP3 |
| Anzahl der Kerne | 24 |
| Anzahl der Threads | 48 |
| Grundfrequenz | 2850 MHz |
| Turbo Core | 4000 MHz |
| Freigeschalteter Multiplikator | keine |
| Architektur (Kern) | Milan |
| Lithographie | 7 nm |
| TDP | 200 W |
| Produkt-Website | öffnen > |
| Interner Speicher | |
| L1 Cache, Кb | 24x32 + 24x32 |
| L2 Cache, Кb | 24x512 |
| L3 Cache, Кb | 131072 |
| Integrierte Module | |
| iGPU | keine |
| Speichercontroller | 8-Kanal (DDR4-3200) ECC memory support |
| PCIe-Controller | PCI Express 4.0 (128 Lanes) |
| Andere Module |
• GPIO • I2C controller • LPC bus • SD controller • Secure processor • SPI controller |
| Anweisungen, Technologien | |
|
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • SSE4A • AES (Advanced Encryption Standard) • AVX (Advanced Vector Extensions) • AVX 2 (Advanced Vector Extensions) • BMI1, BMI2 (Bit Manipulation inst.) • SHA (Secure Hash Algorithm extensions) |
• F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add) • AMD64 • EVP (Enhanced Virus Protection) • AMD-V (AMD Virtualization) • SMAP (Supervisor Mode Access Prevention) • SMEP • Secure Encrypted Virtualization • Secure Memory Encryption • Precision Boost 2 • SMT (Simultaneous MultiThreading) • Pure Powe |
Leistung:
vergleichen
Filter:
| × |
Smartphones 
Mobile SoCs
Grafikkarten
Spiele
Prozessoren