Grundinformation: | |
Veröffentlicht | 2016 |
Segment | Mobile |
Socket | Socket FP4 |
Anzahl der Kerne | 4 |
Anzahl der Threads | 4 |
Grundfrequenz | 2400 MHz |
Turbo Core | 3300 MHz |
Freigeschalteter Multiplikator | keine |
Architektur (Kern) | Carrizo-PRO |
Lithographie | 28 nm |
TDP | 15 W |
Max. Temperatur | 90° C |
Produkt-Website | öffnen > |
Interner Speicher | |
L1 Cache, Кb | 2x96 + 4x32 |
L2 Cache, Кb | 2048 |
L3 Cache, Кb | keine |
Integrierte Module | |
iGPU |
Radeon R5 series 720 MHz, 384 shaders |
Speichercontroller | 2-Kanal (DDR4-1866) |
PCIe-Controller | PCI Express 3.0 (8 Lanes) |
Andere Module |
• I2C controller • Secure processor • TrueAudio accelerator • UART • Unified Video Decoder (UVD) • Video Coding Engine (VCE) |
Anweisungen, Technologien | |
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • SSE4A • AES (Advanced Encryption Standard) • AVX (Advanced Vector Extensions) • AVX 2 (Advanced Vector Extensions) • BMI1 (Bit Manipulation inst. 1) |
• F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add) • FMA4 (4-operand Fused Multiply-Add) • TBM (Trailing Bit Manipulation) • XOP (eXtended Operations) • AMD64 • EVP (Enhanced Virus Protection) • AMD-V (AMD Virtualization) • Turbo Core 3.0 • PowerNow! |