| Grundinformation: | |
| Veröffentlicht | 2021 |
| Segment | Server |
| Socket | LGA4189 |
| Bus | 3 UPI 11.2 GT/s |
| Anzahl der Kerne | 8 |
| Anzahl der Threads | 16 |
| Grundfrequenz | 3600 MHz |
| Turbo Boost | 3700 MHz |
| Freigeschalteter Multiplikator | keine |
| Architektur (Kern) | Ice Lake-SP |
| Lithographie | 10 nm |
| TDP | 165 W |
| Max. Temperatur | 69° C |
| Produkt-Website | öffnen > |
| Interner Speicher | |
| L1 Cache, Кb | 8x32 + 8x32 |
| L2 Cache, Кb | 8x1024 |
| L3 Cache, Кb | 18432 |
| Integrierte Module | |
| iGPU | keine |
| Speichercontroller | 8-Kanal (DDR4-3200) ECC memory support |
| PCIe-Controller | PCI Express 4.0 (64 Lanes) |
| Andere Module | keine |
| Anweisungen, Technologien | |
|
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • AVX 512 (Advanced Vector Extensions 512) • BMI1, BMI2 (Bit Manipulation inst.) • F16C (16-bit Floating-Point conversion) |
• FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost 2.0 • TSX (Transactional Synchronization Extensions) • MPX (Memory Protection Extensions) • SMAP (Supervisor Mode Access Prevention) • SMEP • Enhanced SpeedStep tech. |
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