Grundinformation: | |
Veröffentlicht | 2023 |
Segment | Desktop |
Socket | LGA4677 |
Bus | 32 GT/s |
Anzahl der Kerne | 24 |
Anzahl der Threads | 48 |
Grundfrequenz | 2200 MHz |
Turbo Boost | 4800 MHz |
Freigeschalteter Multiplikator | ja |
Architektur (Kern) | Sapphire Rapids |
Lithographie | 10 nm |
TDP | 225 W |
Max. Temperatur | 94° C |
Produkt-Website | öffnen > |
Interner Speicher | |
L1 Cache, Кb | 24x32 + 24x48 |
L2 Cache, Кb | 24x2048 |
L3 Cache, Кb | 46080 |
Integrierte Module | |
iGPU | keine |
Speichercontroller | 4-Kanal (DDR5-4800) ECC memory support |
PCIe-Controller | PCI Express 5.0 (64 Lanes) |
Andere Module | keine |
Anweisungen, Technologien | |
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • AVX 512 (Advanced Vector Extensions 512) • BMI1, BMI2 (Bit Manipulation inst.) • F16C (16-bit Floating-Point conversion) |
• FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost • TXT (Trusted Execution tech.) • TSX (Transactional Synchronization Extensions) • Total Memory Encryption • Deep Learning Boost • Enhanced SpeedStep tech. |