Basic information: | |
Released | 2019 |
Segment | Mobile |
Socket | BGA1377 |
Bus | 4 GT/s |
Number of cores | 4 |
Number of threads | 8 |
Base frequency | 1200 MHz |
Turbo Boost | 4500 MHz |
Unlocked multiplier | no |
Architecture (core) | Amber Lake-Y |
Lithography | 14 nm |
TDP | 7 W |
Max. temperature | 100° C |
Products webpage | follow > |
Internal memory | |
L1 Cache, Кb | 4x32 + 4x32 |
L2 Cache, Кb | 4x256 |
L3 Cache, Кb | 8192 |
Integrated modules | |
iGPU |
Intel UHD Graphics 617 300 - 1150 MHz |
Memory controller | 2-channel (LPDDR3-2133, DDR3L-1600) |
PCIe controller | PCI Express 3.0 (10 lines) |
Other modules |
• Ethernet controller • Hardware HD audio codec • SATA controller • USB controller |
Instructions, technology | |
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • BMI1, BMI2 (Bit Manipulation inst.) |
• F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost • MPX (Memory Protection Extensions) • Enhanced SpeedStep tech. |