| Basic information: | |
| Released | 2025 |
| Segment | Mobile |
| Socket | BGA1264 |
| Number of cores | 4 |
| Number of threads | 4 |
| Base frequency | 1000 MHz |
| Turbo Boost | 3600 MHz |
| Unlocked multiplier | no |
| Architecture (core) | Twin Lake |
| Lithography | 10 nm |
| TDP | 6 W |
| Max. temperature | 105° C |
| Products webpage | follow > |
| Internal memory | |
| L1 Cache, Кb | 4x32 + 4x64 |
| L2 Cache, Кb | 2048 |
| L3 Cache, Кb | 6144 |
| Integrated modules | |
| iGPU |
Intel UHD Graphics 24 EUs, 1000 MHz |
| Memory controller | 1-channel (DDR4 3200, DDR5 4800, LPDDR5 4800) |
| PCIe controller | PCI Express 3.0 (9 lines) |
| Other modules |
• GPIO • Hardware HD audio codec • USB controller |
| Instructions, technology | |
|
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • BMI1, BMI2 (Bit Manipulation inst.) |
• F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • TXT (Trusted Execution tech.) • MPX (Memory Protection Extensions) • Enhanced SpeedStep tech. |
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