| Basic information: | |
| Released | 2019 |
| Segment | Server |
| Socket | LGA3647 |
| Bus | 10.4 GT/s UPI |
| Number of cores | 28 |
| Number of threads | 56 |
| Base frequency | 2700 MHz |
| Turbo Boost | 4000 MHz |
| Unlocked multiplier | no |
| Architecture (core) | Cascade Lake-SP |
| Lithography | 14 nm |
| TDP | 205 W |
| Max. temperature | 90° C |
| Products webpage | follow > |
| Internal memory | |
| L1 Cache, Кb | 28x32 + 28x32 |
| L2 Cache, Кb | 28x1024 |
| L3 Cache, Кb | 42708 |
| Integrated modules | |
| iGPU | no |
| Memory controller | 6-channel (DDR4-2933) ECC memory supported |
| PCIe controller | PCI Express 3.0 (48 lines) |
| Other modules | no |
| Instructions, technology | |
|
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • AVX 512 (Advanced Vector Extensions 512) • BMI1, BMI2 (Bit Manipulation inst.) • F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add inst.) |
• EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost • TXT (Trusted Execution tech.) • TSX (Transactional Synchronization Extensions) • SMAP (Supervisor Mode Access Prevention) • SMEP • Deep Learning Boost • Enhanced SpeedStep tech. |




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