| Basic information: | |
| Released | 2017 |
| Segment | Mobile |
| Socket | BGA1356 |
| Number of cores | 2 |
| Number of threads | 4 |
| Base frequency | 3300 MHz |
| Turbo Boost | 3700 MHz |
| Unlocked multiplier | no |
| Architecture (core) | Kaby Lake-U |
| Lithography | 14 nm |
| TDP | 28 W |
| Max. temperature | 100° C |
| Products webpage | follow > |
| Internal memory | |
| L1 Cache, Кb | 2x32 + 2x32 |
| L2 Cache, Кb | 2x256 |
| L3 Cache, Кb | 4096 |
| L4 Cache | |
| Integrated modules | |
| iGPU |
Intel Iris Graphics Plus 650 300 - 1100 MHz |
| Memory controller | 2-channel (DDR3L-1600, LPDDR3-1866, DDR4-2133) |
| PCIe controller | PCI Express 3.0 (12 lines) |
| Other modules | no |
| Instructions, technology | |
|
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • BMI1, BMI2 (Bit Manipulation inst.) • F16C (16-bit Floating-Point conversion) |
• FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost 2.0 • MPX (Memory Protection Extensions) • SGX (Software Guard Extensions) • Enhanced SpeedStep tech. |
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