Grundinformation: | |
Veröffentlicht | 2015 |
Segment | Mobile |
Socket | BGA1364 |
Bus | 5 GT/s DMI2 |
Anzahl der Kerne | 4 |
Anzahl der Threads | 8 |
Grundfrequenz | 3300 MHz |
Turbo Boost | 3800 MHz |
Freigeschalteter Multiplikator | keine |
Architektur (Kern) | Broadwell-H |
Lithographie | 14 nm |
Transistoren, Mil. | 1300 |
TDP | 65 W |
Max. Temperatur | 105° C |
Produkt-Website | öffnen > |
Interner Speicher | |
L1 Cache, Кb | 32+32x4 |
L2 Cache, Кb | 256x4 |
L3 Cache, Кb | 6144 |
L4 Cache | eDRAM (128 MB) |
Integrierte Module | |
iGPU |
Intel Iris Pro Graphics 6200 300 - 1150 MHz, 48 exec. units |
Speichercontroller | 2-Kanal (DDR3L-1333/1600/1866) |
PCIe-Controller | PCI Express 3.0 (16 Lanes) |
Andere Module | keine |
Anweisungen, Technologien | |
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • BMI1, BMI2 (Bit Manipulation inst.) |
• F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Turbo Boost 2.0 • TSX (Transactional Synchronization Extensions) • Enhanced SpeedStep tech. |