| Grundinformation: | |
| Veröffentlicht | 2020 |
| Segment | Mobile |
| Socket | BGA1090 |
| Anzahl der Kerne | 2 |
| Anzahl der Threads | 2 |
| Grundfrequenz | 2000 MHz |
| Turbo Boost | 2700 MHz |
| Freigeschalteter Multiplikator | keine |
| Architektur (Kern) | Gemini Lake |
| Lithographie | 14 nm |
| TDP | 15 W |
| Max. Temperatur | 105° C |
| Produkt-Website | öffnen > |
| Interner Speicher | |
| L1 Cache, Кb | 2x32 + 2x24 |
| L2 Cache, Кb | 4096 |
| L3 Cache, Кb | keine |
| Integrierte Module | |
| iGPU |
Intel UHD Graphics 600 250 - 700 MHz, 12 ex.units |
| Speichercontroller | 2-Kanal (DDR4-2400, LPDDR4-2400) |
| PCIe-Controller | PCI Express 2.0 (6 Lanes) |
| Andere Module |
• eMMC controller • Hardware HD audio codec • I2C controller • I2S controller • LPC bus • SATA controller • SPI controller • UART • USB controller |
| Anweisungen, Technologien | |
|
• MMX • SSE • SSE2 • SSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) |
• VT-d (Virtualization for directed I/O) • BPT (Burst Performance tech.) • MPX (Memory Protection Extensions) • SGX (Software Guard Extensions) • SHA (Secure Hash Algorithm extensions) • SMAP (Supervisor Mode Access Prevention) • SMEP • Enhanced SpeedStep tech. |




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