Grundinformation: | |
Veröffentlicht | 2020 |
Segment | Mobile |
Socket | BGA1090 |
Anzahl der Kerne | 2 |
Anzahl der Threads | 2 |
Grundfrequenz | 2000 MHz |
Turbo Boost | 2700 MHz |
Freigeschalteter Multiplikator | keine |
Architektur (Kern) | Gemini Lake |
Lithographie | 14 nm |
TDP | 15 W |
Max. Temperatur | 105° C |
Produkt-Website | öffnen > |
Interner Speicher | |
L1 Cache, Кb | 2x32 + 2x24 |
L2 Cache, Кb | 4096 |
L3 Cache, Кb | keine |
Integrierte Module | |
iGPU |
Intel UHD Graphics 600 250 - 700 MHz, 12 ex.units |
Speichercontroller | 2-Kanal (DDR4-2400, LPDDR4-2400) |
PCIe-Controller | PCI Express 2.0 (6 Lanes) |
Andere Module |
• eMMC controller • Hardware HD audio codec • I2C controller • I2S controller • LPC bus • SATA controller • SPI controller • UART • USB controller |
Anweisungen, Technologien | |
• MMX • SSE • SSE2 • SSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) |
• VT-d (Virtualization for directed I/O) • BPT (Burst Performance tech.) • MPX (Memory Protection Extensions) • SGX (Software Guard Extensions) • SHA (Secure Hash Algorithm extensions) • SMAP (Supervisor Mode Access Prevention) • SMEP • Enhanced SpeedStep tech. |