Grundinformation: | |
Veröffentlicht | 2018 |
Segment | Embedded |
Socket | Socket FP5 |
Anzahl der Kerne | 4 |
Anzahl der Threads | 8 |
Grundfrequenz | 3350 MHz |
Turbo Core | 3600 MHz |
Freigeschalteter Multiplikator | keine |
Architektur (Kern) | Great Horned Owl |
Lithographie | 14 nm |
TDP | 45 W |
Max. Temperatur | 105° C |
Produkt-Website | öffnen > |
Interner Speicher | |
L1 Cache, Кb | 4x64 + 4x32 |
L2 Cache, Кb | 4x512 |
L3 Cache, Кb | 4096 |
Integrierte Module | |
iGPU | keine |
Speichercontroller | 2-Kanal (DDR4-2400) ECC memory support |
PCIe-Controller | PCI Express 3.0 (16 Lanes) |
Andere Module |
• eMMC controller • Ethernet controller • GPIO • I2C controller • LPC bus • Platform Security Processor • SATA controller • Secure processor • SPI controller • USB 3.0 controller |
Anweisungen, Technologien | |
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • SSE4A • AES (Advanced Encryption Standard) • AVX (Advanced Vector Extensions) • AVX 2 (Advanced Vector Extensions) • BMI1, BMI2 (Bit Manipulation inst.) |
• F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add) • AMD64 • EVP (Enhanced Virus Protection) • AMD-V (AMD Virtualization) • SMAP (Supervisor Mode Access Prevention) • SMEP • Secure Encrypted Virtualization • Secure Memory Encryption • SMT (Simultaneous MultiThreading) |