| Basic information: | |
| Released | 2009 |
| Segment | Mobile |
| Socket | Socket S1 |
| Bus | 1800 MHz 16-bit HT (3.6 GT/s) |
| Number of cores | 2 |
| Number of threads | 2 |
| Base frequency | 2700 MHz |
| Turbo Core | no |
| Unlocked multiplier | no |
| Architecture (core) | Caspian |
| Lithography | 45 nm |
| TDP | 35 W |
| Max. temperature | 100° C |
| Products webpage | follow > |
| Internal memory | |
| L1 Cache, Кb | 2x64+2x64 |
| L2 Cache, Кb | 2048 |
| L3 Cache, Кb | no |
| Integrated modules | |
| iGPU | no |
| Memory controller | 2-channel (DDR2-800) |
| PCIe controller | no |
| Other modules | no |
| Instructions, technology | |
|
• MMX • 3DNow! • SSE • SSE2 • SSE3 |
• SSE4A • AMD64 • AMD-V (AMD Virtualization) • EVP (Enhanced Virus Protection) • PowerNow! 2.0 |
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