| Información básica: | |
| Año de lanzamiento | 2021 |
| Segmento | Server |
| Socket | LGA4189 |
| Bus | 3 UPI 11.2 GT/s |
| Número de núcleos | 36 |
| Número de hilos | 72 |
| Frecuencia base | 2100 MHz |
| Turbo Boost | 3500 MHz |
| Multiplicador desbloqueado | no |
| Arquitectura (núcleo) | Ice Lake-SP |
| Litografía | 10 nm |
| TDP | 210 W |
| temperatura máx. | 81° C |
| Página del producto | abrir > |
| Memoria interna | |
| L1 Cache, Кb | 36x32 + 36x32 |
| L2 Cache, Кb | 36x1280 |
| L3 Cache, Кb | 55296 |
| Módulos integrados | |
| iGPU | no |
| Controlador de memoria | 8 canales (DDR4-3200) ECC memory support |
| Controlador PCIe | PCI Express 4.0 (64 carriles) |
| Otros módulos | no |
| Instrucciones, tecnologías | |
|
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • AVX 512 (Advanced Vector Extensions 512) • BMI1, BMI2 (Bit Manipulation inst.) • F16C (16-bit Floating-Point conversion) |
• FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost 2.0 • TSX (Transactional Synchronization Extensions) • MPX (Memory Protection Extensions) • SMAP (Supervisor Mode Access Prevention) • SMEP • Enhanced SpeedStep tech. |




Smartphones
SoC Móviles
Tarjetas gráficas
Juegos
Procesadores