| Información básica: | |
| Año de lanzamiento | 2019 |
| Segmento | Server |
| Socket | LGA3647 |
| Bus | 10.4 GT/s UPI |
| Número de núcleos | 24 |
| Número de hilos | 48 |
| Frecuencia base | 2400 MHz |
| Turbo Boost | 3900 MHz |
| Multiplicador desbloqueado | no |
| Arquitectura (núcleo) | Cascade Lake-SP |
| Litografía | 14 nm |
| TDP | 165 W |
| temperatura máx. | 90° C |
| Página del producto | abrir > |
| Memoria interna | |
| L1 Cache, Кb | 24x32 + 24x32 |
| L2 Cache, Кb | 24x1024 |
| L3 Cache, Кb | 36608 |
| Módulos integrados | |
| iGPU | no |
| Controlador de memoria | 6 canales (DDR4-2933) ECC memory support |
| Controlador PCIe | PCI Express 3.0 (48 carriles) |
| Otros módulos | no |
| Instrucciones, tecnologías | |
|
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • AVX 512 (Advanced Vector Extensions 512) • BMI1, BMI2 (Bit Manipulation inst.) • F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add inst.) |
• EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost • TXT (Trusted Execution tech.) • TSX (Transactional Synchronization Extensions) • SMAP (Supervisor Mode Access Prevention) • SMEP • Deep Learning Boost • Enhanced SpeedStep tech. |




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