| Grundinformation: | |
| Veröffentlicht | 2018 |
| Segment | Embedded |
| Socket | Socket SP3 |
| Anzahl der Kerne | 16 |
| Anzahl der Threads | 32 |
| Grundfrequenz | 2150 MHz |
| Turbo Core | 3000 MHz |
| Freigeschalteter Multiplikator | keine |
| Architektur (Kern) | Snowy Owl |
| Lithographie | 14 nm |
| TDP | 80 W |
| Max. Temperatur | 105° C |
| Produkt-Website | öffnen > |
| Interner Speicher | |
| L1 Cache, Кb | 16x64 + 16x32 |
| L2 Cache, Кb | 16x512 |
| L3 Cache, Кb | 32768 |
| Integrierte Module | |
| iGPU | keine |
| Speichercontroller | 4-Kanal (DDR4-2666) ECC memory support |
| PCIe-Controller | PCI Express 3.0 (64 Lanes) |
| Andere Module |
• eMMC controller • Ethernet controller • GPIO • I2C controller • LPC bus • SATA controller • Secure processor • SPI controller • USB 3.0 controller |
| Anweisungen, Technologien | |
|
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • SSE4A • AES (Advanced Encryption Standard) • AVX (Advanced Vector Extensions) • AVX 2 (Advanced Vector Extensions) |
• BMI1 (Bit Manipulation inst. 1) • SHA (Secure Hash Algorithm extensions) • F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add) • AMD64 • EVP (Enhanced Virus Protection) • AMD-V (AMD Virtualization) • SMAP (Supervisor Mode Access Prevention) • SMEP • Precision Boost |
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