Grundinformation: | |
Veröffentlicht | 2017 |
Segment | Server |
Socket | LGA3647 |
Bus | 10.4 GT/s UPI |
Anzahl der Kerne | 18 |
Anzahl der Threads | 36 |
Grundfrequenz | 3000 MHz |
Turbo Boost | 3500 MHz |
Freigeschalteter Multiplikator | keine |
Architektur (Kern) | Skylake-SP |
Lithographie | 14 nm |
TDP | 240 W |
Max. Temperatur | 85° C |
Produkt-Website | öffnen > |
Interner Speicher | |
L1 Cache, Кb | 18x32 + 18x32 |
L2 Cache, Кb | 18x1024 |
L3 Cache, Кb | 25344 |
Integrierte Module | |
iGPU | keine |
Speichercontroller | 6-Kanal (DDR4-2666) ECC memory support |
PCIe-Controller | PCI Express 3.0 (48 Lanes) |
Andere Module | keine |
Anweisungen, Technologien | |
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • AVX 512 (Advanced Vector Extensions 512) • BMI1, BMI2 (Bit Manipulation inst.) |
• F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost 2.0 • TXT (Trusted Execution tech.) • TSX (Transactional Synchronization Extensions) • Enhanced SpeedStep tech. |