Basic information: | |
Released | 2017 |
Segment | Server |
Socket | LGA3647 |
Bus | 10.4 GT/s UPI |
Number of cores | 18 |
Number of threads | 36 |
Base frequency | 3000 MHz |
Turbo Boost | 3500 MHz |
Unlocked multiplier | no |
Architecture (core) | Skylake-SP |
Lithography | 14 nm |
TDP | 240 W |
Max. temperature | 85° C |
Products webpage | follow > |
Internal memory | |
L1 Cache, Кb | 18x32 + 18x32 |
L2 Cache, Кb | 18x1024 |
L3 Cache, Кb | 25344 |
Integrated modules | |
iGPU | no |
Memory controller | 6-channel (DDR4-2666) ECC memory supported |
PCIe controller | PCI Express 3.0 (48 lines) |
Other modules | no |
Instructions, technology | |
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • AVX 512 (Advanced Vector Extensions 512) • BMI1, BMI2 (Bit Manipulation inst.) |
• F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) • NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost 2.0 • TXT (Trusted Execution tech.) • TSX (Transactional Synchronization Extensions) • Enhanced SpeedStep tech. |